Meeting our customers' needs for greater efficiency and scalability, our pathbreaking innovations in 3DIC Compiler have carved out a lead in 3D silicon realization by delivering a single platform from exploration to signoff," said Shankar Krishnamoorthy, GM and corporate staff for the Silicon Realization Group at Synopsys. "The 3D workflow has traditionally been extremely fragmented and iterative, with multiple tools and flows needed to achieve multi-die system integration, thus limiting engineering productivity. It is built on the common, scalable data model of the highly integrated Synopsys Fusion Design Platform™, and enables multi-die integration co-design and co-analysis to provide a single, hyper-convergent environment for 3D visualization, pathfinding, exploration, design, implementation, analysis and signoff. 3DIC Compiler is a complete, end-to-end solution for efficient multi-die design and full-system integration. They provide end-product modularity and flexibility to mix and match separate technologies into solutions addressing different market segments or needs. Multi-die integration -in which many chip dies are stacked and integrated in a single package-are growing in popularity as a means to meet system specifications in terms of PPA, functionality, form factor and cost. "Co-design and co-analysis of silicon and advanced packages with Synopsys' 3DIC Compiler platform is another example of how our close collaboration results in advanced productivity solutions that reduce turnaround time and costs for our mutual customers."
#LOGIN USING SAMSUNG FLOW FULL#
"Together, Synopsys and Samsung Foundry are easing the way to optimized multi-die designs through early to full system implementation and signoff analysis," said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. As a result, mutual customers will be able to productively manage the complexities of 2.5D and 3D designs, while benefiting from power, performance and area (PPA) advantages and scalability to support hundreds of billions of transistors via a single 3DIC platform.
(Nasdaq: SNPS) today announced that its 3DIC Compiler unified 2.5D and 3D multi-die package co-design and co-analysis platform has been qualified for Samsung Foundry's Multi-Die Integration (MDI™) flow.
17, 2021 - To strengthen innovation of complex SoCs for compute-intensive applications such as high-performance computing, AI and 5G, Synopsys, Inc. Mutual Customers Gain Full Exploration-to-Signoff 3DIC Solution to Manage Complexity of Hundreds of Billions of Transistors
0 kommentar(er)
